DEK’s DirEKt Ball Placement Technology Advances toward Microsphere Capability
From a DEK press release:
Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement(TM) process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.
Unlike alternative methods that employ serial approaches for placement of solder balls, the parallel print process of DirEKt Ball Placement allows for unmatched, repeatable accuracy and exceptionally fast cycle times which are completely independent of I/O count. While these statistics are arguably impressive and consistent with requirements for next-generation wafer-level CSP devices, DEK is also upholding its pledge to continuously enhance DirEKt Ball Placement capability.