DEK’s DirEKt Ball Placement Technology Advances toward Microsphere Capability
From a DEK press release: Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement(TM) process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield [...]